Xyztec drives innovation in bond testing As the technology leader in bond testing, xyztec continues to lead the way in innovation, redefining precision, speed, and efficiency in t ...
Worldwide Silicon Wafer Shipments and Revenue Start Recovery in Late 2024: Summary Global silicon wafer demand began rebounding in late 2024 after the 2023 downturn, SEMI SMG repo ...
Broadcom, TSMC eye possible Intel deals to split storied chipmaker, WSJ reports: Summary Intel faces potential breakup as Broadcom and TSMC explore acquisition deals, the Wall Str ...
TSMC will not take over Intel’s chipmaking operations despite U.S. pressure, analysts say. While the Trump administration seeks greater TSMC investment in U.S. fabs, experts warn that acquiring Intel ...
Summary Taiwan’s semiconductor industry is set to surge 16.2% this year, reaching NT$6.17 trillion (US$183.51 billion), outpacing global growth at 11.2%. TSMC leads with a 20.1% rise, fueled by AI and ...
Summary Automotive sensor fusion is evolving, integrating cameras, radar, and lidar into zonal controllers or central compute modules for smarter data processing. High-speed automotive Ethernet ...
Summary TSMC reaffirmed that its Arizona investment plan is on track, despite reports suggesting an accelerated timeline for its third wafer fab. The company is investing over $65 billion, with its ...
EDN Read the Full Article The dedicated team at Semiconductor Packaging News has provided this summary for your convenience.
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