(Santa Barbara, Calif.) -- Take a wire paperclip. Now, bend it back and forth in the same spot 15, maybe 20 times. Chances are the paperclip will have broken before you finish. This is due to what's ...

With the semiconductor industry moving toward 3D DRAM, 3D logic architectures, and 1000+ layer 3D NAND stacks, 1 mechanical failures may become more common. Due to the complexity of these structures, ...

Complex fluids, such as polymer melts and concentrated suspensions, are foundational materials for industrial products, including high-strength plastics and optical components. The final performance ...

Thermo-compression processing optimizes Cu/SiC composites, improving strength and toughness by improving particle ...

The rapid adoption of 3D integrated circuits (ICs) and heterogeneous packaging heralds a new era in semiconductor design. Benefits are clear: greater functional density, reduced footprint, and ...

The semiconductor industry is undergoing a transformation as 3D integrated circuits (ICs) and heterogeneous packaging become mainstream. With these advances comes the promise of higher functional ...

Knots are known for boosting the strength of materials, from the tiniest twists of DNA to (potentially) the very fabric of the universe. Now, Caltech engineers have developed a new material consisting ...

The study shows that DAANAC exhibits strong thermal and photochemical stability yet remains highly responsive to mechanical ...