Abstract: Thermomechanical stress induced by through-silicon vias (TSVs) plays an important role in the performance and reliability analysis of 2.5D/3D ICs. While the finite element method (FEM) ...

Abstract: Chiplet heterogeneous integration (CHI) is one of the important technology choices to continue Moore’s law. However, due to the characteristics of high power and low supply voltage in CHI ...

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Bond EP5TC-80 is a NASA low outgassing rated epoxy ...

This git repo is for Thermal Shield project ( Develop a lightweight, high-performance thermal protection system for SpaceX's Starship.) This repository provides a collection of advanced high-tech code ...

Cool-3D is an end-to-end thermal-aware framework built for early-phase design space exploration (DSE) of microfluidic cooling equipped 3DICs. It is built on top of mainstream computer architecture ...