Abstract: Thermomechanical stress induced by through-silicon vias (TSVs) plays an important role in the performance and reliability analysis of 2.5D/3D ICs. While the finite element method (FEM) ...
Abstract: This study evaluates outdoor thermal comfort in Labban Square, El Mina, Lebanon, using ENVI-met, a microclimate simulation tool designed to support urban planning and outdoor environmental ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback