Abstract: This article introduces a hybrid 3-D frequency selective structure (FSS) that offers high stopband suppression and low insertion loss to mitigate pattern degradation resulting from the ...
./app --help ***** *** DBSCAN Cluster Segmentation *** ***** Usage: ./app [options] Optional arguments: -h --help shows help message and exits [default: false] -v ...
Dec 8 (Reuters) - Structure Therapeutics (GPCR.O), opens new tab said on Monday its obesity pill showed weight loss of up to 11.3% after 36 weeks of treatment in a mid-stage study, driving the company ...
Abstract: The through-silicon via (TSV) technology is widely used in 3-D integrated circuit (3-D IC) devices. However, the TSV could cause great thermal stress due to the mismatch of the thermal ...
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