Creep and Stress Rupture testing evaluates the behavior of materials (plastics, metals, composites, and ceramics) under prolonged stress, and usually elevated temperatures to simulate conditions that ...

Complex fluids, such as polymer melts and concentrated suspensions, are foundational materials for industrial products, including high-strength plastics and optical components. The final performance ...

Thermal and mechanical stresses are creating significant challenges in heterogeneous chiplet assemblies, increasing the time and cost required to work through all the possible physical effects, ...

Thermo-compression processing optimizes Cu/SiC composites, improving strength and toughness by improving particle ...

The rapid adoption of 3D integrated circuits (ICs) and heterogeneous packaging heralds a new era in semiconductor design. Benefits are clear: greater functional density, reduced footprint, and ...

The study shows that DAANAC exhibits strong thermal and photochemical stability yet remains highly responsive to mechanical ...

The rise of 3D integrated circuits (ICs) and heterogeneous packaging is reshaping how automotive ICs fulfill demanding analog and sensor requirements. Whether for ...