A newly designed robust mechanophore provides early warning against mechanical failure while resisting heat and UV, report ...
A newly designed robust mechanophore provides early warning against mechanical failure while resisting heat and UV, report ...
Stressors like demanding flight schedules contribute to anxiety, fatigue and impaired performance, with long-term exposure ...
Managing thermal and mechanical stress in multi-die assemblies will require a detailed knowledge of how and where a device will be used, how it will be packaged, and where stresses could cause ...
Cell-to-cell junctions were visualized by ZO1-GFP, and the dynamics of cell junctions were captured by movies. When the cells indicated by * were spontaneously stretched, a continuous belt of cell ...
SHUNDE, GUANGDONG, CHINA, December 31, 2025 /EINPresswire.com/ — Foshan AoChuanShun New Material Industrial Co., Ltd. (ACS) has announced the alignment of its latest product technical specifications ...
The move to heterogeneous multi-chip/chiplet products improves yield, performance and modularity while reducing power and overall product footprint. However, this shift to heterogeneous assembly also ...
The rapid adoption of 3D integrated circuits (ICs) and heterogeneous packaging heralds a new era in semiconductor design. Benefits are clear: greater functional density, reduced footprint, and ...
Cell membranes play a crucial role in maintaining the integrity and functionality of cells. However, the mechanisms by which they perform these roles are not yet fully understood. Scientists have used ...
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